Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
Electronics Forum | Tue Oct 11 19:57:04 EDT 2005 | hly
Hi folks, I had posted this earlier but I think there was some confusion on where the wrinkled joints were. The picture is the side view of a BGA soldered onto the PCB. I was able to take this picture becuase the BGA was at the edge of the board. I
Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Wed Sep 10 10:04:52 EDT 2008 | vladig
And I bet you are not alone :-). All I'm trying to say is that there are problems which can be fixed by knob turning, but there are also others which can not. So, the appropriate analysis should be done to find the root cause and fix them. In the re
Electronics Forum | Tue Mar 15 21:12:45 EST 2005 | Ronald
As a QA guy, I cannot find a portable equipment to check lead free solder in the container during processing.
Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker
If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time
Electronics Forum | Thu Sep 11 14:47:40 EDT 2008 | rarnold
For Production purposes, the problem goes away when a new solder paste lot is used. As I reported in my first message though, the problem keeps coming back. Most likely, paste lot is not the Root Cause (3 different lots now in the last 6mo). I rea
Electronics Forum | Tue Oct 14 07:22:05 EDT 2008 | ccouture
I use this directly in the solder pot inside the wave machine. It is small enough to float at the surface of the solder, yet by loading it it act as a sieve and retains the dross while most of the solder pass trough, allowing me to clean the whole po
Electronics Forum | Fri Nov 03 09:31:35 EDT 2017 | davef
On the flux reside issue that is gumming up your test probe pogos ... Short term, clean what's in process with a aerosol flux cleaner solvent. Ask your flux supplier for recommendations. Longer term, recognizing that there is no fix, your improveme
