Electronics Forum | Fri Jun 25 09:19:12 EDT 2004 | tjensen
60-70% RH will be a challenge if you are running a water wash solder paste (and could be the reason you are seeing the problems). If you are running a no-clean, humidity should not be an issue. As long as the profile looks OK, I don't think the con
Electronics Forum | Mon Sep 28 09:23:03 EDT 2015 | slave2anubis
Hi, sorry for reopening a old thread, but i wanted to ask if there is a way to know at what temperature the solder melts if you have a chip with underfill? I thnk its lower then normal air-fill temperature since the underfill conducts heat better the
Electronics Forum | Thu Sep 07 16:50:44 EDT 2006 | greg york
Just reading these comments are really interesting but very baffling. That if the solder manufacturers produces solder which 'is' actually Virgin high quality material and treated with conventional metallic anti drossing agents AND continue to add th
Electronics Forum | Fri Jan 15 10:52:27 EST 1999 | John
| Hi all, | | I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: | First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wav
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Tue Jul 20 08:37:42 EDT 1999 | Dave F
| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Baddia: That everyone with English as their first la
Electronics Forum | Thu Jan 08 13:47:13 EST 2004 | guest
It is my understanding that per IPC specs toe fillets are not required as they do not add any strength to a solder connection. Our thoughts were allways that proper toe fillets are a sign of a good process. What are some of your guidelines and though
Electronics Forum | Wed Jul 09 11:58:03 EDT 2003 | sam
When we try another test by using less solder paste, we found under the microscope that the solder was actually stick on the LED gold surface, but not having good wetting. By this finding, we can basically conclude that it was poor solderability caus
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Fri Jun 27 08:39:35 EDT 2003 | davef
It's a excellent idea to monitor the cleanliness of your components and soldering process. Consider running a spare board.
