Electronics Forum | Mon Jun 14 07:23:42 EDT 1999 | Vinesh Gandhi
We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre to
Electronics Forum | Wed Dec 20 12:49:06 EST 2006 | paul_bmc
I am looking for white papers or information on what happens to 63/37 solder paste alloys when overheated. I have had some solder joint analysis done regarding missing finish on some of the joints. The analysis came back showing a low lead content
Electronics Forum | Wed Jun 26 11:13:09 EDT 2002 | robbied
Can anyone help? Our Solder bar suppier is discontinuing the Sn63 Pb37 solder that they currently supply us. Another company has offered us a 'direct replacement' which is their own Sn63 Pb37 solder bar. The only problem I have with this is that the
Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Fri May 29 14:35:05 EDT 1998 | Steve Gregory
| We are getting solder balls after reflow of surface mount components. We are using a no-clean paste and a new jar seemed to help for a little bit. Any ideas? Thanks in advance Hello Ryan, There's a quite a few things that can cause solder bal
Electronics Forum | Thu Apr 01 12:05:21 EST 2004 | babe
Heat guns scare me, hot air scares me too. Just the heck of it why not apply high temp paste to the center and eutectic 63/37 standard solder to the outside pads. The outside reflows first allowing proper seating of the component and with a proper pr
Electronics Forum | Tue Mar 20 19:26:12 EDT 2012 | hegemon
We have produced good results on our ACE machines. We keep 2 of them constantly busy, one for regular solder and one for pbFree. Customer service has been good as well. Be sure to use the Nitrogen feature, and invest in a N02 generator for your sele
Electronics Forum | Mon Jan 26 04:48:48 EST 1998 | Grant Petty
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Fri Mar 19 11:48:06 EST 2004 | Ken
This is the dilema during this transition period. Here is a tip: If you see typcial solder joints on a lead free process, but only on one component type....it probably has a significant quantity of lead in it (ex. Sn90/Pb10...and so on) If using T
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