Electronics Forum | Wed Jan 26 15:55:31 EST 2005 | davef
There is: * NO information to indicate leadfree solder is at all reliable regardless of class of operation. * NO material model for leadfree solder, whereas the model for lead solder was developed over many years back during a time when companies be
Electronics Forum | Tue Apr 05 12:31:05 EDT 2022 | proceng1
A while back, we had a yellow coating showing up on some solder joints at Selective Solder (LEAD alloy). I contacted the company for our machine and he looked into it. One change we had made not too long before is we switched from Superior 75 to Sup
Electronics Forum | Thu Apr 11 11:32:23 EDT 2002 | barryg
Hello everyone. We are interested in doing double sided surface mount. What methods are there for doing this. I know you can wave solder some smt components, but what are the limitations. Is there a method of doing this that uses 2 different solder p
Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz
We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki
Electronics Forum | Tue Jun 05 07:07:57 EDT 2012 | mosborne1
You should just be running you Kic or Mole to verify the process.Every new board should be profiled. Once have verified the process there should be no reason to keep prifiling the boards. Your QA dept should be inspecting the solder joints. If there
Electronics Forum | Mon Aug 13 11:05:18 EDT 2007 | saaitk
Would I be correct in assuming that the solder used to attach the BGA ball to the device body should have a higher liquidous point that the solder used to attach the device to the board. If the peak reflow temp for SnPb is around 225 deg should the b
Electronics Forum | Thu Dec 29 09:03:03 EST 2016 | sumote
I would cut a piece of cardboard to the same dimensions as your circuit card. Run that through the fluxer of your machine and pull it out before the pre-heater. Take a look at the cardboard and verify that flux has been sprayed on it. That board look
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Sat Jul 24 23:18:00 EDT 1999 | Scott McKee
| We are going to smt ic's on the component side of our pcb's. | The problem is we are going to have to do this by hand. | We have a hot air station and vac pencil, but How reliable is this process. | We've tried it on proto's and had some shorting p
Electronics Forum | Thu Jul 17 15:12:18 EDT 2008 | slthomas
To quote a regular here, "Are you sure your washer is set up correctly?" :P He's a WS junkie. This is a really common problem and is discussed here often. Mid chip solder balls (solder beads) are almost always the result of too much paste being dep