Electronics Forum | Mon Nov 26 13:09:20 EST 2007 | realchunks
Even a slight amount of epoxy will prevent a part from soldering. Look at the part after print. If you any trace of you epoxy between the pad and part, you have a potential problem.
Electronics Forum | Thu Jan 29 16:48:49 EST 2009 | slthomas
Looks like a time/temperature problem to me. However, there are a lot of solder fines surrounding the pads in one photo that go beyond what I'd expect from inadequate TAL. Is it possible that the board was misprinted and not completely cleaned, or
Electronics Forum | Wed Sep 23 21:40:29 EDT 2009 | davef
We apply temporary solder mask off line, using a programmable dispense head. Works fine. Purchasing a placement machine with a dispense head usually only works-out well for the sales-type. Not in every case, but usually.
Electronics Forum | Mon Jun 04 20:55:55 EDT 2001 | craigj
Have been having problems with the above IC but dont know why. Our profile is well within the manufacuters recommendations. We are getting a higher than desired first off fail rate and are concerned. It is not possible to inspect the soldering as the
Electronics Forum | Thu Jun 14 22:50:45 EDT 2001 | gregH
Hi, I read an article that says "Flux selection usually depends on the following factors": a) Solderability of pcb base metal or coating b) Corrosivity of vapours and residues c) electrical resistivity of residues d) Ease of removal of residues e)
Electronics Forum | Tue Dec 29 08:11:18 EST 1998 | Kelvin Chow
As CSP and BGA packages become more and more popular, I want to know if anyone get problem to assembly CSP packages. Currently, most CSP use 20mil solder ball diameter and it is a trend to go down to 16mil or even 12mil. I wonder if there is a probl
Electronics Forum | Fri Feb 21 19:49:36 EST 2003 | MA/NY DDave
Hi Good Luck Neil, When I first saw this process described, what you are experiencing was my first visual thoughts. Partial filling as well as huge solder voids inside of the joints. I figured for low reliability product or short life maybe this t
Electronics Forum | Mon Apr 12 10:39:48 EDT 2004 | Ron Herbert
Correct preheating of the assembly is critical. Check with your flux manufacturer regarding the recommended topside pcb temperature as it enters the first wave. It is important that this temperature be achieved without burning the flux on the bottom
Electronics Forum | Tue Sep 28 05:04:10 EDT 2004 | grayman
In obtaining almost zero defect in solder wave. I would like to suggest the following: First,We must consider changing machine if it is more than 5 years old. second, use the right tools for the right job. Most of the traditional engineers will us
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As