Electronics Forum | Tue May 09 18:30:35 EDT 2006 | muse95
I can understand the theory behind fewer tombstones with SAC. If people were having tombstone problems with SnPb eutectic solder, often switching to Sn62Pb36Ag2 would improve it, because with the addition of some silver, a small plastic zone in the
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Wed Apr 14 13:37:56 EDT 1999 | Mark Charlton
Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are found in solder
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Wed Oct 23 02:45:17 EDT 2019 | maxwilko
Hello there, My 'MyChronic MyData My500 Solder Jet printer' keeps having the same issue and I am unable to solve the issue. Suction flow too low: Check filter box and suction holes are clear. This problem would usually be solved by a new filter bo
Electronics Forum | Tue Dec 28 12:26:22 EST 1999 | Christopher Lampron
Rick, Does the ultrasonic cleaning system that you use reuse the same water for each cleaning cycle? I have had a similar problem in the past using a Brandson ultrasonic cleaner and water soluable flux. The problem was the buildup of flux in the clea
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Fri Jan 29 05:14:06 EST 1999 | Graham Naisbitt
Hi guys, I really am at a loss to understand this one. It would appear that there may be some reaction between the flux and the resist? Or maybe you have an OSP on the board that is reacting during soldering? As a fast fix, maybe you should try a
Electronics Forum | Wed Mar 22 17:28:13 EST 2000 | Steve Harshbarger
Donnie, It's funny you ask this question. I just last month was at a company doing exactly what you are asking (Alpha 310 flux with infrared heating). They were successful, but they had 2 important things going for them. 1) A spray fluxer that wa
Electronics Forum | Fri Aug 08 07:52:26 EDT 2003 | pteerink
We have seen this for quite a while too ( chip components and IC's with lead free plating on the terminations ) and we did just what Dave said, crank up the heat. Also switched to newer formulations of solder paste, that are "more active" and have gi
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