Electronics Forum | Tue Jan 31 11:56:12 EST 2006 | kmorris
Just wanted to take a quick poll, as to how others are taking flux density measurements on their wave solder machines.(those that don't have flux density contollers) We are using a glass hydrometer, but I see there is a digital model on the market.
Electronics Forum | Mon Jul 01 08:33:55 EDT 2013 | markhoch
A couple things to look at.. Are you using Pb-Free solder? What are the leads of the SD Connector tinned with? Do you have a thermal profiler to use to verify your oven profile? (If not, you may be able to ask a Sales Rep to come in and assist y
Electronics Forum | Fri Dec 27 13:16:18 EST 2019 | slthomas
Can you describe the failure mode of the soldering defect, i.e., is it failing to meet the height requirement for a castellated termination due to not wetting of the component terminations, or not wetting the pads sufficiently, or....? We install a
Electronics Forum | Fri Dec 19 17:20:17 EST 2008 | davef
We don't know dip a about rigid flex. Flexdude wrote "Hot-Bar Soldering, Attaching Flex Circuits Directly To Rigid Boards" [http://www.flexdude.com/Back%20Issues/FCN11-00A.PDF ]. It may help you get started while waiting for others reply. We have n
Electronics Forum | Wed Jun 24 18:41:23 EDT 1998 | Bill Chrisitian
| Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exactl
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
Electronics Forum | Thu Aug 11 21:43:19 EDT 2005 | Ken
Those temp stickers are useless unless you can stick them into the copper barrel. They can only determine "skin" temperature which has nothing to do with what is happening in the barrels. Your solder is filling the barrel then going cold. I'll gua
Electronics Forum | Thu Jan 22 03:18:02 EST 1998 | Eldon Sanders
I'll bet the rate of temperature change may be the problem. A large black thin package will heat quickly, and the package peak temp will be greater than what you measured on the board. The bottom of the package will heat slower than the top, creati
Electronics Forum | Thu Sep 06 09:49:26 EDT 2001 | ksfacinelli
This is a real problem. We have experimented with a number of off the shelf products as well as discussed the issue with a few solder manufacturers. As you are aware IPA or Flux off can make the product look worse. I would discuss with the custome
Electronics Forum | Wed Jul 03 07:45:22 EDT 2002 | Yannick
Hello, We have some probleme here with our solder joints, I read a lot about what sould I do before pass a board in the oven, what should I consider to make my profile and there is one thing I can't find is how to calculate the thermal mass of my
