Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Wed Aug 11 10:21:03 EDT 1999 | Brian
| Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation
Electronics Forum | Mon Aug 18 10:42:04 EDT 2008 | floydf
We are in the process of preparing for a new board that requires paste in hole processing. The hole is a .020" via, and our customer wants it filled with solder, but not bulging past flush. For printers,we use a DEK 249 with a squeegee, and a DEK 260
Electronics Forum | Sat Aug 03 08:44:11 EDT 2002 | P. Kannan
We are having 3 MPM UP-2000 printer & 1 AP-25 printer with us. I would like to have the technical guidance for my following application. For one of our model, there is a requirement of Glue & solder paste on same side of the PCB. Currently we are u
Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Tue May 03 15:15:33 EDT 2005 | dphilbrick
The biggest problem is getting paste on the board. We ran a board that had 8 per and would get an occasional insufficient solder joint. I would look into doing the boards with something like a SiPad process (www.sipad.net) My $0.02
Electronics Forum | Wed Apr 19 07:45:50 EDT 2006 | Carol Stirling
Sorry about that. I'd like to post a picture but doubt it's possible. Baseball cap = The pad solder reflows but the BGA ball and the pad don't reflow together in a continuous elliptical shape. Carol
Electronics Forum | Fri Nov 21 09:29:11 EST 2008 | saintete1304
Hi , i desire to find the type of information : When the Soldering must be performed after baking for the PWB to not have a POP problem link to the moisture ? And the time for a flexible PWB ? thanks best regards
Electronics Forum | Tue Apr 28 04:07:56 EDT 2009 | davepick
There's a nice tool on this site - http://www.enhancetechnical.co.uk/ Click on Internet Tools and then the image - brings up a useful interactive tools which helps understand influences on wave solder bridges. Dave
Electronics Forum | Fri Apr 20 21:16:29 EDT 2018 | sarason
And if it is a hard rubber nozzle for a large IC make sure it is still pliable. And solder paste isn't stuck up the end of your nozzle sarason
