Electronics Forum | Wed Jan 10 17:11:53 EST 2007 | mscalzo3
I always try to profile using a fully populated board and soldering the thermocouples. This is the only true way of getting an actual temperature of the joints. But, with that being said, its not always feasible to use this. There have been a coup
Electronics Forum | Thu Apr 16 10:11:51 EDT 2015 | hugh_manatee
Your solder paste manufacturer’s profile is just a “guideline.” You can customize your profile to meet your product’s need. For better grain-structure (shiney-ness) try a ramp soak spike profile keeping your preheat temps very low before your reflo
Electronics Forum | Wed Feb 16 20:50:57 EST 2022 | mihai_voivod
Its hard to answer your questions with fuzzy pictures, no background, or a schematics/BOM. Your best bet for good answers is to contact the manufacturer or obtain another board so you have spare parts. In the 1st picture The epoxy is there probably t
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Mon Feb 20 09:20:07 EST 2006 | dpmilk
It appears to us that the problem lies in the lead-free solder paste rather than the inductors. We have not found a lead-free solder that does not do this. The green is on the copper wire. We believe it gets there during the reflow. The gasses fr
Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon
| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it
Electronics Forum | Sat May 09 11:46:43 EDT 1998 | Bob Willis
The first thing is all the TSOP suppliers like Intel do not rate the parts at normal temperature used in wave soldering. The spec is less than 230C so you have the reliability issue to consider and no one to blame when they do not work. You also have
Electronics Forum | Tue Aug 03 09:47:39 EDT 2004 | AJ
Hi All, I have a question for everyone regarding SSD - Solid Solder Deposit. I have read many good articles on this "new" process and was wondering why it has not caught on. It is better known in the US as SIPAD or Precision Pad Technology. Here is
Electronics Forum | Tue Mar 20 10:27:36 EDT 2007 | davef
Print styles: Print - Most common print mode * A single print stroke forward on first board * A single print stroke reverse on next board Print-Print (Double Print) * Both forward and reverse printing strokes * Helps to ensure complete filling of th
