Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea
My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e
Electronics Forum | Tue Apr 10 10:10:03 EDT 2001 | Rob Fischer
Obviously the less mass in the wave the better. There will be less heat sinking and less push on the solder. Pallet thickness is typically a function of the tallest component on the board. If the board has one component that is tall but small in a
Electronics Forum | Wed Feb 11 18:21:39 EST 2004 | Steve
Does anybody know if there is such a thing as individual component paste stencils, and who would sell such an item? The reason I am asking is because we have instances when we build prototypes that we don't need a full stencil. We may only need to pl
Electronics Forum | Fri Apr 23 07:50:50 EDT 2004 | smtpro
We have switched over form Indium's nc-smq92 to nc-smq92j and are experiencing a ton of solder balls. Even if the print is dead on we still seem to be getting them. We never seemed to have this problem with old paste unless the print was way off. Is
Electronics Forum | Fri Oct 06 12:58:07 EDT 2006 | cw
hi All, Anyone use snap on type EMI sheilding before? I would like to provide a DFM to a customer who currently have a EMI shield soldered on the boards, which i found this not quite manufacturing friendly as it block the view for inspection, plus re
Electronics Forum | Fri Oct 06 13:04:31 EDT 2006 | cw
hi All, Anyone use snap on type EMI sheilding before? I would like to provide a DFM to a customer who currently have a EMI shield soldered on the boards, which i found this not quite manufacturing friendly as it block the view for inspection, plus re
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
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