Electronics Forum: solder a (Page 716 of 1481)

Intrusive Reflow

Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman

Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide

Re: water soluable or no clean flux?

Electronics Forum | Tue Sep 21 02:51:06 EDT 1999 | Mohammed saad

Thank you all for your help. about your question Wolfgang, I am using no-clean solder paste from Kester. Mohammed | | Hi all, | | | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we ne

Re: 1206 Jumper

Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon

| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl

Can anyone tell me that between Mirtek & Kohyoung which AOI machine will be better and why?

Electronics Forum | Tue Feb 17 12:58:11 EST 2015 | anvil1021

The MV-7 OMNI is a Great Machine, has the same 3D Solution MV-9 Quad Moire Multi Frequency System. You will not be disappointed, you will find new ways to use the 3D system as time goes on and it is rock stable and incredibly precise. Either the MV-

Re: Wetting Balance Equipment

Electronics Forum | Wed Aug 12 07:18:29 EDT 1998 | Earl Moon

| Looking for Suppliers of surface mount wetting balance equipment. I've used Kester's equipment. It conforms to, and performs in accordance with requirements Dave stated. It's expensive stuff ($32K last time I bought one). For this reason, you migh

Standards &/or Specifications for PBGA Assembly/Inspection

Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef

In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *

Ultrasonic stencil cleaners

Electronics Forum | Mon Oct 22 13:21:12 EDT 2001 | Michael Konrad

Eric, The Kolb RB6D (and the RB5D) are not ultrasonic cleaners. They are high pressure spray cleaners. I would not recommend high pressure spray cleaners for misprinted assemblies with previously placed components (unless you don�t mind solder pas

reflow temp/ic damage

Electronics Forum | Mon Jan 28 07:40:40 EST 2002 | cnotebaert

Yes and Yes, Your solder supplier should recomend a profile (standard profile) in most cases you can follow it. Of course you should be running a thermal profile of each board type to verify it is within the specified temp rang. You should also chec

BGA Contact

Electronics Forum | Thu Jul 25 22:03:50 EDT 2002 | davef

I need help understanding your problem. * What�s the difference between �e-test failure� and �total failure�? * Why do you think that an ESD induced failure would only be a �total failure�? * What if this is caused by a cracked solder connection? Yo

Step stencil troubles

Electronics Forum | Fri Sep 17 07:44:41 EDT 2004 | Simon Uk

Yes, i have used and experienced problems with step stencils, but these were mainly to do with the communication of the requirements for the suppier. Best plan is to talk to your stencil supplier and get them to make the suggestions on what works bes


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