Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas
I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to
Electronics Forum | Sat Jun 04 15:06:20 EDT 2005 | slthomas
After profiling with a scrap board of the product I'm profiling, I would immediately send the MOLE through with one thermocouple only, no board, to provide a standard that I could reproduce without depending on scrap boards. I used that setup before
Electronics Forum | Mon Jul 31 12:59:19 EDT 2006 | slthomas
Nothing like making a handful of changes all at once to confuse an issue, huh? Did you (or whomever ordered the stencil) spec. the same stencil design parameters that you would normally have used? We've never done fine pitch of any sort on silver
Electronics Forum | Tue Dec 26 10:54:37 EST 2006 | yusufgomec
We use hot air leveling (HAL) process in pcb production. HAL process is 3 steps. �n 1. step flux. 2. step is HAL. And 3. step is rinsing. As you know there is mustn't any flux after rinsing operation. Our flux chemical is water soluable. But there ar
Electronics Forum | Sun Mar 25 17:02:41 EDT 2007 | johnwnz
Folks, I may be havign a thick day, it is Monday afterall and it has been very sunny over the weekend. We have recently started buildign a fairly high volume of products that is using intrusive reflow on two PTH DIN connectors and havign soem good s
Electronics Forum | Wed Jun 13 15:40:44 EDT 2007 | slthomas
Edited because I completely misinterpreted your post. We used 2 lengths of Durapol with slots for the board edges and a shorty (free-floating, not attached) under the middle. Not much more elaborate than your titanium shims but we had it laying aro
Electronics Forum | Mon Oct 16 16:30:27 EDT 2023 | yannick_herzog
@MagyarT the error occurred across multiple PCBs throughout the entire job. So, for example, the issue isn't limited to just the first printed one but spans the entire duration. At what dimensions would you recommend a division? The apertures on the
Electronics Forum | Mon Apr 04 09:45:55 EDT 2005 | Homer
IPC may help, otherwise there are many factors: Are the PTH clinched or straight? If straight, what length protrusion? What direction are the parts running thru wave? Is product on a pallet? Not to mention your soldering process: What type of mach
Electronics Forum | Tue Dec 05 16:08:41 EST 2006 | dphilbrick
I would suspect if you had a full evaluation done there would be the same issue with Nickel oxidation everywhere. The reason BGA's fall off (or have solder connection issues first) is due to their size. A slight flex in the board has a much larger im
Electronics Forum | Fri Feb 15 07:52:27 EST 2008 | lococost
Dear SMTnetters, I've been told to have a look at finding a machine that could mill the leads of all PTH components to a certain height on an assembeled and soldered PCB. PCBs should be inserted in one side of the machine and come out milled on the