Electronics Forum | Thu Sep 02 12:40:55 EDT 1999 | John Thorup
| Dear Netters, | | Can you kindly suggest what cause solder splash in IR reflow boards ?? What are the main causes normally ?? | | | Best Rgds, | Felix | Felix - we need a better description of what it looks like. If it's a spray, usually balls
Electronics Forum | Sat Jul 10 02:47:27 EDT 1999 | Scott
| | | Hi! | | | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board
Electronics Forum | Mon Oct 03 22:16:58 EDT 2005 | Ken
If that's the case, let your customer go. I have run into this situation recently. Q. Why do you not run a dedicated line for lead free? A. You (the customer) give less than 12 weeks forcast and expect us to have a dedicated line for your product?
Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F
| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should
Electronics Forum | Thu Jan 28 17:31:20 EST 1999 | Earl Moon
| | | Hello Netters, | | | | | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that t
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Tue Jul 15 10:05:23 EDT 2008 | patrickbruneel
Ck, Just to make myself clear I am not at all questioning your observations. What am trying to make clear is that when your wave contact area changes when the PC board or glass plate traveling speed is changed, something is wrong!!! Also an 180Deg
Electronics Forum | Wed Oct 14 16:58:30 EDT 1998 | Earl Moon
| It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | Q: Can you get away with spending 25K? 30K? H
Electronics Forum | Thu Jul 19 22:12:52 EDT 2001 | davef
We don't use the connector that is giving you soldering problems. Regardless, no one here is taking bets that you'll get pay-back from increasing the length of the locking pin. If it makes you feel any better, we'd bet against a 4-40 flat head and
Electronics Forum | Sun Jul 29 08:36:39 EDT 2001 | davef
You have provided very little information. Two similar possibilites come to mind: poor pad solderability protection and old boards. POOR SOLDERABILITY PROTECTION: Maybe the nickel plating under the gold is oxidized, contaminated, or otherwise very
