Electronics Forum | Fri Jun 16 18:48:57 EDT 2006 | GS
Hi Grant, just my opinion, I think the concern could be related to the extra temperature the BGAs have been exposed during the Lead Free Reflow Temperature. So you need to check ( data sheet) what is the max temperature and how long the Pb/BGA can w
Electronics Forum | Fri Jul 27 08:49:35 EDT 2007 | cman
We are currently have failures on one of our QFN > components. We are running this product with > lead free paste, lead free boards and lead free > parts. They have done a pull test on this > component and it showed that the solder joint > mai
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc
5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht
Electronics Forum | Thu Mar 24 17:37:35 EST 2005 | SuePH
Am looking for a table top mini wave to remove connectors or solder in connectors in hard to reach areas. Can anyone recommend a good brand. Thanks
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Fri Dec 12 10:28:30 EST 1997 | David Syracuse
I am interested in locating a water soluble resist mask that does not leave a residue after wash and is easy to work with during the screen printing process. I have tried the Alpha Metals 110 and 220 solder mask and have found that it does not leave
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Tue Mar 13 13:13:39 EST 2001 | cebukid
Not to toot my own horn, but ever since I came on board at my company, wave solder defects have gone down by 35%. This was due mainly to a new flux and a process control system that I implemented back in '99. Now, the metric used was DPMO. How do
Electronics Forum | Thu Dec 12 12:54:25 EST 2013 | jaimebc
For selective soldered components, or even hand soldered, with vertical bend components, the body of the component, in this case a resistor, is making contact with the surface of the PCB, making it impossibe to visually see the solder fillet. Or to d
