Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Fri Jun 04 17:26:11 EDT 1999 | C.K.
| | | | Geez, those test guys are always whining about via holes, aren't they? I even had one test guy go over to our finals/add-on department and instruct everone to look for unfilled vias and fill them by hand! Without consulting the area manage
Electronics Forum | Wed Nov 02 08:57:34 EST 2005 | russ
Don't have any graphics but they are relatively simple. 1. They do need to be put into the copper. 2. We usually use a 1mm circle but many other shapes and sizes are useable but I know that all machine will take a circle. 3. Maintain a keepout area
Electronics Forum | Fri Jun 15 11:05:17 EDT 2007 | grantp
Hi, This is a little embarrassing asking this question, as I think I am profiling our oven incorrectly. I have been using the profile based on the solder paste specification, however we have been getting a large BGA chip coming more unreliable, and
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko
Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath
Electronics Forum | Sat Mar 03 23:24:55 EST 2001 | CAL
We test Parts and Components to IPC J-std-002/003. We also use a wetting Balance tester to determine solderability. We also test with SERA. We use ROSA to electrochemically revert the components back to their original state. Need more info ... email
Electronics Forum | Mon Dec 06 06:06:44 EST 1999 | Glen brian
Recently, my plant met the problem of bridging, a metallic link, lying on the solder mask and joining nearby joints. It is very diffcult to observe by our inspector and may be only discovered with ICT testing. This defect ocurrs randomly around the
Electronics Forum | Wed Aug 28 03:22:05 EDT 2002 | TLe
We are producing quite a lot PCB:s with Organic solderability protection on them. With some products we have printing problems eventhough printing parameters and PCB manufacturers for boards are same. Question: Could it be that the OSP itself or some
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
