Electronics Forum | Thu Jan 22 15:51:08 EST 2004 | solderboffin
CBGA devices are a bit trickier to reball than run of the mil plastic devices. Once assemblied they are a bit like a sandwich when fitted to a PCB. From top to bottom it goes BGA device - Eutectic solder - High temp solder ball - eutectic solder -
Electronics Forum | Wed Oct 03 12:04:55 EDT 2001 | slthomas
When we found this to be a problem with some QFP 100's (.020" pitch, and our first experience with fine pitch - 48 of them on a 2-up panel), we saw that the solder was running up the leads during reflow and staying there, leaving the fillets thin or
Electronics Forum | Mon Aug 09 10:31:10 EDT 1999 | Boca
| Earl, why don't you post this ALSO in the "Mart". Is there a reason? | | | | | | | Folks, | | | | | | | | Probably not the forum, but forgive me as I am but a dog as described by Justin and admitted by me. However, I am looking for a previously
Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown
Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications
Electronics Forum | Tue Jun 28 10:51:32 EDT 2005 | mattkehoe
Thanks for the replies, - solder paste used ? NC ? other ? Water soluble 63/37 paste - reflow in Air or N2 ? Infrared - temp ramp up before soack (�C/second) ? Will have to check. This profile has been used on numerous gold plated boards in our
Electronics Forum | Mon Oct 09 15:53:49 EDT 2006 | russ
We like to use the type thast solders onto board and only the top of it is snapped on, this way we can use equipment to place shield and remove shield when required for access to component. We also utilize a through hole shield but basically solder
Electronics Forum | Mon Oct 09 15:57:10 EDT 2006 | russ
We like to use the type thast solders onto board and only the top of it is snapped on, this way we can use equipment to place shield and remove shield when required for access to component. We also utilize a through hole shield but basically solder
Electronics Forum | Sun Oct 29 22:47:03 EST 2006 | LMPH
We are going to start doing rework of Lead Free BGA's. Have always used flux for SN/Pb boards/BGA's with good results. Can flux be used fro lead free as well? Boards were originally assembled using lead free paste and components. Hence, the BGA w
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
Electronics Forum | Sun Nov 23 20:37:36 EST 2014 | gregp
Hi J_Dub, thanks for the continued info...Of course selective soldering would be very time consuming for such a through hole assembly...but 18 minutes, wow...didn't realize selective soldering could take that long. I would like to know the approxima
