Electronics Forum: solder and a (Page 1061 of 1724)

Re: Gold plated components - solderability issue

Electronics Forum | Mon Mar 30 12:55:16 EST 1998 | Justin Medernach

| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

BGA rework machine operator pay

Electronics Forum | Tue May 04 16:43:41 EDT 2004 | russ

So the only difference between the "regular solderers" and the BGA people is trace repair? If that is it than you should put the pay in range with your PCB repair people. We do not pay any extra for BGA rework since all they do is wick pads (common

Gold Thickness

Electronics Forum | Fri Jun 09 11:18:25 EDT 2006 | kehoem@bellsouth.net

Question; Do you think it's possible that your customer has got his units mixed up & actually means 0.3 micro inches of gold over 0.5 micro inches of Nickel? That is what I said but their vendor says they are building to print which says 80 uM and i

soldering robot

Electronics Forum | Sat Apr 14 08:23:29 EDT 2007 | davef

Laser soldering suppliers are: * Seica [low cost firefly A-30]; 45 Osgood St 1st Flr, Methuen, MA 01844; 978-683-8356 F8357 seicatestsolutions.com/pages/24/A30-Firefly-Solder-Station.php; Dave Sigillo [GM] sigillo@seicausa.com * Leister Process Tech

Thermocouple calibration on reflow oven

Electronics Forum | Thu Apr 15 16:33:40 EDT 2004 | wgaffubar

We never really use to calibrate the thermocouples on our reflow oven or wave solder systems, but we did disconnect the T/C's and input a calibration standard to check that the computer cards were correctly reading the proper temperature for a given

Latent shorts on QFN package

Electronics Forum | Tue Mar 03 14:07:07 EST 2009 | macisaint

I'm having shorts appear on my QFN packages between pins, usually only after a week or so of power-on operation. The shorts are 1K and slowly down to hard shorts over time. Typically a defective part will have failures on multiple pins. I tried havi

Voids problem in Lead free process

Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike

First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm

Re: Residue

Electronics Forum | Tue May 26 15:53:39 EDT 1998 | Chrys

| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to

Re: Warpage at Wave Soldering Stage

Electronics Forum | Wed Jun 16 07:46:45 EDT 1999 | Glynn Technologies and Manufacturing

| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre


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