Electronics Forum | Fri Apr 10 03:39:50 EDT 1998 | Frank J. de Klein
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Fri Mar 10 08:42:40 EST 2000 | John
We're quoting out a new board design, and one of the prospective suppliers is pitching a silver coating process over hot air leveling. We haven't had experience with boards of this type, and I am concerned about any processing issues that may come u
Electronics Forum | Fri Mar 10 08:42:40 EST 2000 | John
We're quoting out a new board design, and one of the prospective suppliers is pitching a silver coating process over hot air leveling. We haven't had experience with boards of this type, and I am concerned about any processing issues that may come u
Electronics Forum | Thu May 21 11:39:21 EDT 1998 | Brian L. Pollitt
| We are looking to bring in a HP 5DX System. This is | the laminography equipment formerly known as Four Pi. | I have our sales rep getting us a few references, but I | wanted to get some opinions from the tech net. | I am looking for input from
Electronics Forum | Mon Jun 21 09:32:28 EDT 1999 | Glenn Robertson
| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Thu Oct 02 17:55:16 EDT 2008 | davef
~le sigh~ makes a good point about forcing bent leads into the solder, letting the solder cool, and releasing the force on the lead. On the other hand, reforming leads of components prior to assembly is dangerous, also, because the "bending of a lead
Electronics Forum | Wed Oct 06 11:41:50 EDT 1999 | Bill Haynes
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Fri Aug 13 07:11:12 EDT 1999 | Earl Moon
Ladies and Gentlemen, As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous insigh
Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
