Electronics Forum | Thu Dec 19 12:08:01 EST 2002 | davef
Facts!!! I got facts. Mechanical strength experiments of Sn43/Pb43/Bi14: �Microstructural And Mechanical Characterization Of 43/43/14 Tin/Lead/Bismuth�; J. Marshall, J. Calderon, J. Sees; Soldering And Surface Mount Technology; 10/91, p25-27 Look
Electronics Forum | Mon Jul 19 19:39:06 EDT 2004 | KEN
I once had a forced convection oven (insert brand here)...and the top 220VAC heater (reflow zone) had shorted to the frame ground, blowing the branch line fuses. THe machine had no idea the heater was out because the lower heater was heating the upp
Electronics Forum | Mon Sep 27 22:25:05 EDT 2004 | KEN
Minimal cost and low melting point??? Have you bought Indium or Bismuth based alloys lately? Tin/Silver, Tin silver coper-X you name it....there are trade-offs (cost / performance). Not all are exactly published or are suitable for all appliations
Electronics Forum | Tue Dec 07 17:38:50 EST 2004 | davef
ANSI/J-STD-003 - Solderability Tests for Printed Boards is widely accepted. That's it, that's the list. If you email us your email address, we'll give you someone to call. Without knowing the number of boards that you plan to run across your wave,
Electronics Forum | Thu May 05 09:17:58 EDT 2005 | jimmiem
I tried soldering to several of the black pads and was successful, the solder stuck with no hesitation. so i guess this is not truly "black pad"? would that be a correct statement? What causes this blackening that looks like oxidation under the mic
Electronics Forum | Thu Nov 17 15:40:23 EST 2005 | Hoss
We have a board that has been diagnosed with inner layer separation from the barrel wall. This board is .093 thick and 12 layers. Several layers, in some cases, have little or no thermal relief making soldering difficult. We have since switched t
Electronics Forum | Mon Dec 12 21:38:05 EST 2005 | davef
Effect of lead on bismuth solders * Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy. * Lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of this eutectic all
Electronics Forum | Fri Feb 24 12:34:13 EST 2006 | Ticky Ticky Tembo No Sarimbo Hari Kari Bushkie Perry Pem Do Hai
Stepped stencils are usually the result of some dumb customer's requirement. 2 examples I can give: 1.) Customer demanded 50% wick-up the termination of a MELF component. No way you can get that from reflow. Played around with a drastic "step up
Electronics Forum | Mon Oct 09 10:00:15 EDT 2006 | C.K. the Flip
I had a customer like this too. Originally, the customer print called for manual soldering of the RF shield (which took us about 20 min. per shield to hand solder), but I changed it to Solder Reflow (I cut apertures on the stencil), with brass weigh
Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet
See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level
