Electronics Forum | Wed May 06 08:15:39 EDT 2009 | xinxi
Hi all, I understand that this forum is more to surface mount discussion. But I am eager in sorting out the spray fluxer problem. Please provide me with any ideas that you think might cause it. I have a problem in starting up/initialising the wave
Electronics Forum | Tue Apr 10 17:44:13 EDT 2001 | davef
Listen, there is a $20 to 30k laseriffic paste measuring system that is not only very expensive and a major bottle neck, but its limited accuracy is the kicker that makes this little item a really special!!! [What a combination, eh???] And that doe
Electronics Forum | Fri Feb 18 11:24:52 EST 2011 | pkannan
The following is my opinion on the Shelf life of the Solder paste. Comments are welcome to support or against it. Solder Paste users often have the issue of Shelf life expiry condition. Companies including big MNCs, order certain quantities, but du
Electronics Forum | Wed Apr 12 20:41:31 EDT 2000 | Dave F
Russ: That�s a pretty stand-up postin� bud. It�s neat that you can root-out that dirt. We couldn�t dig-up that stuff, if they threatened to shoot the dog. You could be correct about using convex for waving. We don�t wave RNET as Philips suggests
Electronics Forum | Sat Jan 22 20:59:51 EST 2000 | Jeff Sanchez
Michael, I am not sure if you are trying to lay out a board with vias in the pads or suffer through an assembly you got stuck with? I am building run of boards right now that has vias in most the smt pads. I'm sure the design group thought it was
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Tue Dec 22 14:29:08 EST 1998 | Earl Moon
| | I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is
Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika
These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,
Electronics Forum | Thu May 21 22:15:05 EDT 1998 | Earl Moon
| | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently
Electronics Forum | Fri Dec 01 00:37:20 EST 2000 | arminski...aka..Dreamsniper
I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o
