Electronics Forum | Thu Jul 01 23:56:06 EDT 2004 | rsthompson
I'm having a philisophical discussion with my boss regarding long reflow soak times to improve soldering under BGA devices. Is there anything to be gained by extending soak times at the 150C level from 60-90 seconds to 5-10 minutes? I've never seen
Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS
Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple
Electronics Forum | Thu Sep 23 14:58:50 EDT 2004 | C Lampron
EMS-Engineer, Lead free alloys have a very low wetting creep. You probably will not ever get the same type of weting with a LF as opposed to SN 63/37. The question is if it is acceptable. Lead free solder joints cannot be inspected to the same crite
Electronics Forum | Wed Nov 17 08:27:35 EST 2004 | Steve
No-Clean has less activators, your profiling Does change. Look at the data sheet supplied by the solder manufacturer. Then tweak the profile based on your equipment, board type, size etc. Don't burn off the activators too quickly. Also keep your chem
Electronics Forum | Wed Mar 30 15:16:35 EST 2005 | Rashid
Hi, I've measured a rework profile on a summit 750. my nearby parts are heating up as high as 178 to 182 degrees C. I'm concerned that this fine pitch parts that are nearby are affected specially their solder joints going to close to melting point.
Electronics Forum | Thu May 19 21:53:07 EDT 2005 | KEN
Is it possible your board is warping and skip plating? Have you run a lev-check? What does your contact patch look like? Do you have ice cikles (spelling???) or solder "flags". IF yes, your flux is consumed or nonexistant. What is your dwell time
Electronics Forum | Thu Aug 11 03:56:11 EDT 2005 | md
Guys, I have a 2.4mm pcb 8layer with a lot of copper on board. I am having some problems with solder not travelling up through the holes. Looking from the bottom of the board it looks fine . Also, To measure temp. of board through preheat zones
Electronics Forum | Tue Aug 16 08:01:20 EDT 2005 | davef
Peter: Questions are: * From your pictures, the white residue appears to be only on the solder mask. Is that correct? If not, what is the location [eg, solder, nonsolder/nonmask areas] of the residue that doesn't show well in the pictures? Further,
Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
Electronics Forum | Fri Sep 16 13:19:59 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
