Electronics Forum: solder and a (Page 1401 of 1724)

Profiling LQFP-144 with ground plane

Electronics Forum | Thu Feb 24 15:36:34 EST 2022 | dontfeedphils

Looks like a decent profile. Only recommendation I have would be to possibly try and high-temp solder the thermocouples rather than the aluminum tape/kapton, only because you can get air-gaps and inaccurate readings using the tape method on assemble

Profiling LQFP-144 with ground plane

Electronics Forum | Thu Feb 24 20:39:05 EST 2022 | joshsvoboda

there is evidence of wetting on the heel. This is the first time I have had this type of joint using SC100C on a leaded part. Usually there is at least some wetting on the sides instead of just looking like it is pressed in and sitting on top of the

Drying PCB after contamination measurement for rework ?

Electronics Forum | Thu Mar 03 14:01:16 EST 2022 | chris007

Hello Baking before solder pasting and reflow actually due to poential moisture development. This is JDEC requirement I believe to do so. We AOI after cleaning so we AOI a clean PCBA

LED Misalignment

Electronics Forum | Mon Apr 25 14:44:26 EDT 2022 | dwl

You could try putting a dot of adhesive like Loc tight chip bonder or similar between the pads. The adhesive will cure before the solder paste hits the reflow temp and hold the LED in place.

Oxidation

Electronics Forum | Mon May 16 21:16:50 EDT 2022 | SMTA-64387687

Can you brush some flux on the connector pins and run them through a heat cycle, hot enough to activate the flux, but not enough for solder to melt or component damage? That should remove most of the oxidation. Then, you can run it through your regul

Soldering under nitrogen atmosphere

Electronics Forum | Tue Jul 19 18:40:41 EDT 2022 | emeto

Nitrogen is helping voids, so if you have specific parts that are prone to voids, you might start seeing more voids. Joints will probably look a little dull in comparison and this might affect your existing AOI programs.

SMT chip processing short-circuit bad phenomenon

Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto

Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.

Automatic Solder Dispensing

Electronics Forum | Tue Jan 03 13:34:08 EST 2023 | dontfeedphils

Just to add some more caveats, the rate at which the paste leaves the tube will also be dependent on the (somewhat) fluctuating variables of temp and humidity. This is why a height measurement of the paste roll on the screen works better.

Preference on selective soldering brands? Used gear life?

Electronics Forum | Fri Jan 27 11:44:08 EST 2023 | poly

I'm now looking at Juki / Inertec and Ebso. I can get a used Ubso locally which would be very easy to deal with and they are also the dealer for Inertec / Juki. They will be around the same place but the Ebso will be refurbished and come with some wa

Selective Solder Nozzle Life

Electronics Forum | Fri Feb 24 19:22:58 EST 2023 | SMTA-71549289

From my understanding titanium is typically used for non-wetting nozzles, correct? And then wetting nozzles are made of other metals with a coating that allows it to wet.


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