Electronics Forum: solder and a (Page 1416 of 1724)

RoHS

Electronics Forum | Thu Jun 16 18:11:33 EDT 2005 | Jason Fullerton

The IPC standards have NO bearing on the state of the RoHS Directive - Europe isn't going to change the rules because the IPC has a few draft standards floating around that create a category "RoHS Compliant, except I still have lead in my solder". Th

Lead Free Stencil Design

Electronics Forum | Wed Jul 13 14:08:13 EDT 2005 | russ

We do have solder balling on occasion but it is usually very minimal. When and if this becomes an issue with us we will then utilize the homeplate aperture. We do not wash boards as a general rule. All of our pb free has been no-clean. We can't f

QFP Solder PROBLEM

Electronics Forum | Wed Aug 24 16:03:23 EDT 2005 | avalancher

Sounds to me like you have one of two problems. First would be the pasting of the board. Possiblilty exists that the machine/operator didn't wash the stencil thouroughly, causing a permanent partial blockage in that one corner. Second thing could be

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Thu Sep 15 06:59:33 EDT 2005 | Adam

Hi, No we did not look at Pillerhouse, We were not particular fond of "moving the product" principle to selective (i.e using a gripper over a static nozzle), as often this requires pallets, and our sister plant had already completed testing which a

caps moving from pads

Electronics Forum | Wed Sep 21 08:43:46 EDT 2005 | kmeline

We are having problems with a 1210 cap moving as far as a 1/4 inch from its pads during reflow. We have verified the placement before reflow. They will tombstone some of the time. There are smaller and larger parts around this location and none of th

Reflow soldering of 208-RQFP-0.5mm

Electronics Forum | Tue Nov 01 12:29:35 EST 2005 | russ

I just noticed that you mention 2-5mm off, that is huge! It would seem to me that there is an external force here to move a part that far. Things such as a heavy air stream that for some reason is really hitting this part, something on the PCB unde

Screen Printing Print Validation

Electronics Forum | Tue Nov 01 09:21:39 EST 2005 | jdengler

I've never heard of this before. If your solder paste is at the correct temperature, and your process is under control you should have an acceptable print the first time. This sounds like a terrible waste on time and paste. Set up a DOE to prove tha

lead free selective soldering

Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug

I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 07:46:41 EST 2005 | chunks

Yup, I saw the original question too. I just can't see how any one would let a stencil manufacturer dictate their processes. Maybe if your designs are small and straight forward, but are you really going to let a stencil maker tell you what product

Microflame vs laser soldering

Electronics Forum | Fri Dec 09 10:40:10 EST 2005 | patrickbruneel

Jim, I don't have direct experience with the methods you mentioned but we have used induction heating in the past and is a very effective way to heat up metals quick. This method is also very easy to automate. I did a quick search as example http://


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