Electronics Forum | Thu Sep 15 12:53:59 EDT 2005 | stepheniii
Talk to the sales reps for your equipment. They might be able to put you in touch with someone who can convince your customers that what you are doing had been done for over a decade now on probably millions of boards and is a proven technology. Pro
Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth
I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the
Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc
I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At
Electronics Forum | Thu Jan 12 12:35:14 EST 2006 | slthomas
Phil's a cool guy. I had a few email exchanges with him when I registered for his site a few years ago. I told him up front that my company at the time wasn't planning on spending any money for services and that I was only digging for information.
Electronics Forum | Mon Feb 13 22:37:40 EST 2006 | KEN
Cleaning no-clean is the pitts. If cleaning required migrate to water soluble. Can IPC help here? No cleans only need to be removed per IPC if the joint inspection is inhibited...and in general if form-fit-funciton is not achievable. But then th
Electronics Forum | Mon May 15 11:25:10 EDT 2006 | muse95
Since when is Hakko putting more plating on their tips? I was told that there was no change to their tips, it was the same tip for Pb or Pbfree. Prior to first use, all Hakko tips are Pbfree. We have been seeing those tips degrade quicker with Pbf
Electronics Forum | Thu Mar 29 07:22:13 EDT 2007 | davef
This does not seem to be a sales pitch. It seems like Mr Johnson was trolling the web and came across a SMTnet Archival posting on the pointlessness of burning product life doing HASS and wanted to engage a conversation on his issue with that commen
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Electronics Forum | Mon Jul 30 16:34:45 EDT 2007 | John S.
We're seeing shorting from the lead of an electrolytic cap to the can. It appears to be solder wicking up the lead, through the boot, and then shorting to the can. Has anyone else experienced this? It is a very cheap cap from China of course, but
Electronics Forum | Thu Mar 20 09:55:11 EDT 2008 | swag
We have a class 3 SMT build that requires the paste conforms to J-STD-005 RE LO. We have not used a low activity flux in the past and would prefer not to have to change our wash process or change to no-clean paste for these builds. I have researche
