Electronics Forum | Tue Nov 22 19:54:45 EST 2022 | davef
Every year, for the holidays, grannies come to the camera store to get their point & shoot cameras fixed. They've replaced the battery, but it still won't work. In the past, we used the eraser on the end of a No.2 pencil to buff the corrosion from th
Electronics Forum | Mon May 15 18:31:28 EDT 2023 | daniel_stanphill
I have found Superior No. 75 to be an absolute miracle worker when it comes to nozzle maintenance. I let our worst nozzles soak in that over the weekend and then the majority of the dross would literally flake off with light pressure from a pick/scre
Electronics Forum | Fri Jun 09 09:57:17 EDT 2023 | tommy_magyar
Regardless of what you choose, pay particular attention on the support they offer. Location of manufacturer/distributor office to be in a couple hours of driving distance, so if there is a problem, they can reach you quickly. We use Inertec - no maj
Electronics Forum | Tue Jul 20 17:47:28 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Tue Sep 15 08:59:59 EDT 1998 | Chrys
| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here
Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos
Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th
Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich
I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi
