Electronics Forum: solder and a (Page 376 of 1724)

Solder Ball and Splash after Hand Soldering

Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef

Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper

I mounted the parts on the buck-boost DCDC converter and measured the characteristics

Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe

I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 15:13:29 EDT 2014 | emeto

Thank you guys. As we are speaking I keep examine the problem and here is what I got so far. 1. I measured the temperatures on my profile and the lead is hotter than the board. The lead goes 12 seconds earlier than the pad and is taking the solder.

High Temp Solders and their use

Electronics Forum | Wed Aug 23 19:01:54 EDT 2000 | kbmacg

For high temperature electronics, operating in 225�C ambient environments, most solders can not be used. The high-lead solders all have difficulties of one sort or another. Is their anything new regarding useful high melting point solders? Especially

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020

Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more

Solder Ball and Splash after Hand Soldering

Electronics Forum | Sun Jul 26 17:13:31 EDT 2009 | slthomas

Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate?

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan

And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Mon Nov 26 09:33:49 EST 2018 | charliedci

The problem you create by soldering from solder destination side (presuming you have already soldered from other side) is that you will trap air in PTH so you have virtually no continuous solder in PTH from one side to other. This will not meet IPC-A

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Wed Jul 30 00:47:10 EDT 2014 | matusov

Hello gurus, I am a hardware designer with a small company. We are about to send a new PCB for fabrication. This board uses dozens of tiny QFN, DFN, and similar packages. As a final check I have been going through the datasheets of all these parts t


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