Electronics Forum: solder and a (Page 66 of 1724)

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b

BGA's and the Fuji IP2

Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef

Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr

So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m

how can i calculate amount of solder paste for a single pcb?

Electronics Forum | Tue May 05 20:21:31 EDT 2015 | bhaskar

i need a menthod for calculating amount of solder paste need in a single pcb or a lot of pcb(1000 pcb). i need reduce wastage of solder paste in the process , so any one can help........

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101

Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo

Leaded and Lead-Free Wave Parameters

Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork

This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are

Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver

Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter

I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you

Stencil and board Ultrasonic cleaner

Electronics Forum | Wed Feb 01 15:36:35 EST 2006 | Darnell

Maybe at dat homie�s shop, they opted ta use Semco ridetridges instead of jars, and they didn�t gots a process put in place ta recycle da old solder paste. - aww yea foo.

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg


solder and a searches for Companies, Equipment, Machines, Suppliers & Information