Electronics Forum: solder and a (Page 716 of 1724)

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Mon Apr 19 17:33:17 EDT 1999 | Tuffty

25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe

Sn100C Plating, Mixed Alloy Scenario

Electronics Forum | Tue Dec 13 15:00:31 EST 2011 | davef

Contaminating lead-free solder connections with lead is generally a bad idea, but that's not what you plan. You plan to add tin to your tin-lead solder connection. We don't think there is a significant problem for most applications. Adding tin will

ENIG poor wetting

Electronics Forum | Tue Jul 30 08:37:39 EDT 2002 | davef

When you talk about 'poor wetting', 'dewett', 'no wets', etc.; are you seeing solder pulling back or away from the pad? Please describe the condition. Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimate

Re: Mid Chip Solder Balls

Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson

As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur

QFP soldering issue

Electronics Forum | Mon Jan 12 08:59:57 EST 2004 | Paul F

I may have a similar problem at the moment with a QFP-68. Do the unsoldered leads leave a perfectly formed footprint in the reflowed solder? Do you usually find this issue occurring towards the corners of the QFP rather than in the middle of a row?

Re: Pad Sizes

Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours

| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .

Preheater for hand soldering

Electronics Forum | Wed Feb 20 13:49:54 EST 2013 | tkotwal

I'm looking for a preheater for hand soldering, but haven't used one before so I could use some advice. Does anyone have any preferred styles or brands? Is there anything in particular that I should either look for or should avoid? I've seen prices r

Novastar or Technical LeadFree Wave

Electronics Forum | Tue Mar 14 15:13:35 EST 2006 | Kevin

The Novastar is primarily a low end machine made in India, I think. Technical Devices is more comparable with other dedicated wave soldering machine manufacturers. I recently got a good deal on a new TD machine with a Titanium Pot and Pump. It was

Gold Bump Flip Chip Attach

Electronics Forum | Thu Dec 24 02:17:22 EST 1998 | Chris Grendler

Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The pit

Solder on gold finger

Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007

We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f


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