Electronics Forum | Thu Jul 18 21:04:06 EDT 2002 | davef
So, why can't you clean misprints on Entek boards? Entek: Cheap, flat, OK shelf life, not without process and fabrication issues. Your Entek organic solderability protection is probably Entek Plus [CU106A] made by Ethone OMI. Consider getting a co
Electronics Forum | Tue Jul 31 17:11:28 EDT 2007 | rpadilla
Is the via hole not supposed to be there, or is this by design? If you are trying to fill the via hole with solder and not have voiding issues, I suggest using a type 4 solder powder mesh size. Reason being, anytime you go beyond Type 4 mesh, to so
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Mon May 12 17:59:55 EDT 2008 | rgduval
We're currently experiencing a spate of solder not wetting to pads of PCBs, and it's becoming more aggravating on a daily basis. At this point, we're running out of ideas. I've searched the Fine Archives for information, and, so far, haven't found
Electronics Forum | Mon Mar 23 16:28:14 EDT 2015 | aqueous
Dendritic growth is always a result of three combined factors: Conductive/corrosive residues Electrical current Moisture A wave solder process normally applies a higher volume of flux than a printed process. Flux however is not the only source. F
Electronics Forum | Tue Aug 29 03:59:28 EDT 2000 | genglish
Hi Francois, I made a recommendation to this question, some one else posted it earlier this month. I have done a little research and evaluated a couple of machines on site. If you require further information regarding the one I purchased for our comp
Electronics Forum | Wed Jun 13 17:15:48 EDT 2001 | medernach
Yes, I've seen it recently and it's most likely a component problem. A cap is essentially a sandwich comprised of multiple layers. the layers are either wet film or dry film. The end terminals may either be hot soldered or sputtered so there are a
Electronics Forum | Thu Feb 18 15:25:13 EST 2010 | spitkis2
An air temperature tolerance of +/- 3 deg C along a 200mm width would not play a significant role on the board's temperature due to its thermal mass. However if the air temperature varies by 10C along the conveyers width, I can see how a 5 degree va
Electronics Forum | Wed Sep 07 00:28:04 EDT 2011 | woodsmt
I have identified a Board design issue and having trouble convincing others of my findings. I have a BGA (Sn63 balls, +1500 IO, 0.6mm ball, 1mm pitch, with heat spreader plate)that has a high incidence of solder shorting on the corners. The board i
Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton
| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar
