Electronics Forum | Thu Dec 09 04:53:36 EST 1999 | Glen brain
Hi, It is wavesoldering defect, in single- sided copper board, using alcohol-based rosin flux. It is not a bridging between the protruding leads but a metallic (I think, it is solder) link, varies in dia./thickness, connected the basement of solde
Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B
We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now
Electronics Forum | Wed Jul 09 10:15:57 EDT 2008 | aj
I have carried out some further measurements on the device and the results are as follow: Component Lead width measures 183 microns. Actuals PAD width measures 158 microns. What I am thinking is that the lead is attracting the solder hence prevent
Electronics Forum | Thu Mar 05 09:54:59 EST 2009 | davef
When you measure "solder paste heigth of 7 & 8 mils using a 5.0 mils stencil," are you measuring the top of a flat brick? Sometimes if you snap-off the stencil too fast, the paste touching the stencil walls form peaks along the edge of the brick that
Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs
I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?
Electronics Forum | Fri Mar 20 13:00:14 EDT 2020 | dwl
I've done over printing for Pin in Past applications and you'd be surprised how much you can over print and still end up with an acceptable solder joint and no solder balls. As others pointed out, there are a lot of variables involved, so trial and
Electronics Forum | Thu Nov 18 08:43:30 EST 1999 | Will Buehler
We currently stuff parts on one side and use a reflow oven. We have been told that many companies are stuffing both sides without high-temp solder or glue. I understand that glue is usually only needed for wave soldering processes. Is it true that
Electronics Forum | Wed Jan 07 09:09:44 EST 2004 | russ
Her is how we rework these typew of components. First remove the device using hot air. It is sometimes helpful to heat the back of the board if possible to get the thermal pad heated with less strain on adjacent comps. Remove the remaining solder
Electronics Forum | Wed Jul 22 11:20:25 EDT 1998 | Russ Miculich
Barbara, I worked for 5 years with advanced materials including silver filled thermoplastics and epoxies for Alphametals. There is a trend towards lead free "solder paste". Some companies are using an Indium alloy paste and others are using a "lea
Electronics Forum | Wed Jun 11 13:11:33 EDT 2008 | namruht
We are currently completely building lead based assemblies. We are going to start doing our homework based on Management request. I have a pretty strange question that I was asked but really did not have an answer to. Can a Lead-Free assembly have a
