Electronics Forum: solder and a (Page 871 of 1724)

no contact on BGA

Electronics Forum | Tue Jun 26 16:43:19 EDT 2001 | CPI

Yes a 6 mil solder deposite will reduce to approx 50% of it's original size. Does this happen on only 1 BGA? Is the BGA that its happening on have smaller balls than the others, what I'm getting to is, are you sure you are depositing the proper amo

Re: Double Reflow

Electronics Forum | Tue Dec 28 15:35:21 EST 1999 | Mike Naddra

Edmund, An 0603 component should not fall from the board durring an inverted reflow pass, provided that: Your land geometries are correct for the package type (Start with SM 782 guidlines)- as surface tension of the liquidous solder is what holds

Re: Selective Soldering

Electronics Forum | Mon Sep 14 17:05:00 EDT 1998 | Rob Fischer

Have you considered using a masking wave solder pallet as opposed to going with new equipment. Utilizing Gerber files we have succesfully designed and manufactured this type of pallet for over five years. If this approach sounds like something you'

High-Temperature Solder Paste/wire: Sn05Pb93Ag02B

Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu

Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST

Selective Laser Soldering

Electronics Forum | Thu Jun 03 18:10:28 EDT 2004 | g2garyg2

It sounds like you will need to pre-heat the aluminum beofre using even a laser to solder this type of application. While lasers are great for many applications, especially those that have challenging keep out areas, thermal mass issues (with approp

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 17:46:13 EDT 2004 | Steve Stach

Both temperature and humidity can cause solder paste to behave in a way to cause these formations. Temperature can cause slumping, slumping spreads out the paste, upon reflow perimeter paste does not join the bulk, and because of insuffient oxide

QFP100 solderability

Electronics Forum | Tue Apr 15 03:16:14 EDT 2008 | janz

Hello, We are having a problem with soldering QFP100 (16mmx16mmx1mm). Board dimensions: 70mmx50mmx1.8. FR4 two layers � single SMT assembly. Finish: HASL-lead free Oven: 7 zones �hot air Paste: lead free We have noticed that two groups of legs

Is Our Blood Leaded Or Unleaded?

Electronics Forum | Wed May 14 08:26:17 EDT 2008 | realchunks

Lead cannot be penetrate your body through your skin by just touching it. You have to swallow it. It does not promote cancer or cause you to go steril like the rumors at my plce of work talk about. Although it is fun to touch people you dislike wi

defects in pcb manufacturing

Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar

Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr

Solder bath temperature

Electronics Forum | Mon Jan 23 08:06:52 EST 2017 | bukas

i have an issue with solder bath temperature. there is a big difference in temperature of alloy in the middle of the bath and at the ends(about 35C). i took down heating elements for inspection and they look fine. its just that most of the heat is cr


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