Electronics Forum | Wed May 11 11:36:43 EDT 2005 | rlackey
Hi Peter, There is no Silver in it, which even in small quantities (0.3%-4%) improves solderability. I would try and see a demo on a similar machine to yours with a similar product as everyone can get their solder to look great in lab/showroom site
Electronics Forum | Wed Apr 11 16:02:21 EDT 2001 | stevearneson
Let me put my two cents into this argument..After being part of many extensive studies conducted to determine the benefits of solder paste inspection, there has never been a case where the customer concluded that paste inspection (Height or Volume)wa
Electronics Forum | Wed Jan 30 12:53:58 EST 2008 | tonyamenson
In approximately one month I am installing 2D at our DEK print station. We are going with the basic (cheap) software options and 2D camera. After it is up and running we will determine if it is indeed useful. At that point we will decide on the adva
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Mon Sep 17 09:47:18 EDT 2012 | mbnetto
Hi, Do you want to replace the SB ou just reflow it again? Do you suspect there is some "colder solder joint" in one of the SB balls ? In my opinion you are heating the board a lot... Did you put some thermocouple on the ball to check the temperat
Electronics Forum | Wed Jan 03 18:44:13 EST 2001 | Todd Koeppel
If we procure parts with a Sn/Ag termination, can we still use standard Sn/Pb solder pastes and the current reflow and wave processes?
Electronics Forum | Fri Apr 21 14:31:20 EDT 2000 | JACOB LACOURSE
I FOUND THAT ONE OF THE MANY REASONS FOR TOMBSTONING COMPONENTS IS MOISTURE IN SOLDER PASTE. ONE WAY TO CONFIRM THIS IS TO CHECK FOR EXCESIVE SOLDER BALLS AROUND THE PART IF THEY ARE PRESENT THEN YOU MAY HAVE A HUMIDITY PROBLEM. GOOD LUCK!!! JAKE
Electronics Forum | Thu Jul 20 16:50:16 EDT 2000 | joevo2k
I was told by a colleague ( and also read an article related to PB-Free Solders) that the deadline for Lead-Free Solders implementation has been moved to the year 2008. Is this true ? Please verify/confirm this information ? Thanks
Electronics Forum | Thu Jul 09 13:05:46 EDT 1998 | Phil Crane
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Thu Jul 09 13:04:19 EDT 1998 | Phil
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
