Electronics Forum | Thu Jun 17 17:05:56 EDT 1999 | Chrys Shea
| Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | for example: | | Solder Bridge | 1.verify amount of flux been aplied. | 2.verify turbulance on your solder wave. | 3.etc.
Electronics Forum | Wed Jun 01 07:34:19 EDT 2005 | davef
It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature. We print paste 1:1 with the pad. �IPC-7351 LP Wizard� is the library mainten
Electronics Forum | Thu Nov 19 20:05:14 EST 2009 | davef
Density. There is a difference between lead (.410 lbs. per cubic inch) and tin (.254 lbs. per cubic inch). The same volume of tin-based solder, therefore, weighs approximately 1/4 less than a lead-based material. This adds up to more joints per pound
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Fri Jun 18 14:24:01 EDT 1999 | Vince Whipple
Tony, I have a great one page solder defect chart I can fax you, send me an email with your fax # and I'll shoot it over to you. vwhipple@sono-tek.com Vince --------------------------------- | Does anyone know where I can find a list of things to
Electronics Forum | Wed Feb 12 16:23:30 EST 2003 | russ
I agree with DDave, You have something else wrong! .100 dips with .05" lead protrusion should not bridge (in fact I would think that it would be almost impossible). Tell us about your machine, (laminar flow, A-wave, etc.., size of nozzle, wave heig
Electronics Forum | Tue Feb 19 15:59:55 EST 2002 | pjc
Surface tension is a likely cause. Surface tension is a negative wetting force. You may have a solderability problem. Be sure your flux is properly activated according to the flux mfg. top side board temp. specification. When surfaces to be soldered,
Electronics Forum | Mon Dec 31 08:11:23 EST 2001 | hany_khoga
Dear all : We are suffering a severe curvature in our boards when coming out of the wave solder m/c. An Engineer suggested to enter them again for a second pass in the m/c expecting board were thermally mistreated just after the W.S. Can this real
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Thu Jan 12 13:21:11 EST 2006 | barryg
Opinions. I have a large finned heatsink that we place over a D2pak transistor. This heatsink is designed to heatsink the transistor through the junction of the pad area that the transistor is attached to. The paste pattern we chose was small dots ar
