Electronics Forum | Mon Aug 10 11:58:33 EDT 1998 | Wayne Bracy
| | I am trying to get an idea of what system seems to work best for solder paste inspection. I am looking for basic table top models with he capabilites of height and width measurements. Can anyone give me suggestions, pricing and why you prefer
Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution
I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i
Electronics Forum | Fri Jan 11 16:33:59 EST 2008 | mgershenson
We have 30 years of soldernig experience, 25 years in soldering robotics, and have had laser based systems for a few years now. I'm not sure you need a laser for this application. It's really going to depend on whether or not an iron tip can get in
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Thu Jun 29 09:29:46 EDT 2000 | JAX
sree, You might want to check the archives. If not, I found this just a few questions below yours!! [Back to thread listing at top] Posted by Igmar on June 22, 2000 at 10:27:26 AM EST Can someone please help with the aperture size on a Micro BGA st
Electronics Forum | Sat Jun 30 04:43:09 EDT 2001 | brendan
Hello We introduced OSP finish on some of our products but now need to add some discretes at the end of the process. From my little knowledge of OSP, this is difficult. We'll SMT the boards and transfer them to another site for further processing.
Electronics Forum | Tue Dec 13 12:46:15 EST 2005 | Slaine
We came across a manufacturer selling us a part that they Classed as RoHS compliant. On further investigations the part was found to contain lead, we use an XRF. The content was over 85% so was exempt and therfor compliant(HMP solder), until we solde