Electronics Forum | Wed Sep 08 14:31:48 EDT 1999 | John Thorup
| | Hello: | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven.
Electronics Forum | Fri Jun 12 06:53:54 EDT 1998 | Earl Moon
| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on
Electronics Forum | Mon Mar 20 18:15:05 EST 2000 | Russ
Larry, SOTs are a wonderful thing to try and wave solder! They are about as nice as Tant caps. I have found that shadowing is usually the biggest problem assuming that the other wave parameters are good, in your case it seems that they are. Couple
Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen
Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e
Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow
It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It
Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Wed Mar 21 16:32:03 EST 2001 | mparker
The root cause is dependant on the type of solder "splash", ball, whatever, that you are seeing post reflow. If it is smears, then cleaning the stencil underside is probably the answer. Are you using automatic wipers? How many print cycles between w
Electronics Forum | Mon Oct 15 13:41:49 EDT 2001 | bschreiber
Hi Dale, I have copies of the articles of which Mike references. If you need copies for support, contact me at: bill@smartsonic.com. Rinsing should be done by ultrasonics also. Spray in atmosphere systems will not penetrate into the same tight ar
Electronics Forum | Thu Sep 11 11:45:33 EDT 2008 | swag
Never did find a fool proof solution. Solderability seemed O.K. (at least using the methods we have available in house). Tinned parts and placed by hand and saw little improvement. Pad design is slightly different than recommended but likely not i
