Electronics Forum | Fri May 14 18:34:28 EDT 1999 | Earl Moon
| What is the best way to re-ball a BGA? Who has the best system for doing it? | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after clean
Electronics Forum | Thu Apr 22 10:57:20 EDT 1999 | Jack Coia
On various PCB's after building processes,such as reflow, flowsolder and wash. The soldermask on the PCB's have become discoloured, like a 'marble' effect all along the solder side of the board, it is lighter in contrast than normal, although when ot
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
Electronics Forum | Tue Jul 05 10:04:59 EDT 2005 | Inds
Hi All, we are running a process where we are wave soldering the PTH components using SAC305 alloy. During rework process (using SAC alloy in the solder pot) we are seeing good amount of Cu dissolution, to an extent that the Cu has completely disapp
Electronics Forum | Thu Dec 20 12:05:46 EST 2007 | realchunks
Not you Steven. Blanket comments like "Double pass printing for solder paste is not needed and will cause defects. Redesign your stencil thickness or aperture sizes, change your paste mesh size or type, go to 45 degree blades." are so way off base.
Electronics Forum | Wed Aug 08 09:10:55 EDT 2012 | davef
The boards are being soldered in the wrong direction. Rotate them 90* and your problem will go away. To demonstrate this further, rotate the board 180* and observe that the problem moves to the opposite side of the connector. I assume that in the
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber
120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
