Electronics Forum | Fri Apr 23 15:33:50 EDT 1999 | C.K.
| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t
Electronics Forum | Wed Sep 11 12:52:14 EDT 2002 | slthomas
We have found that using the SPC capability of the profiler's pc software helps us identify oven malfunctions sooner than we would normally find it. The ovens tend to compensate for dieing or dead blowers by cranking the heaters on for longer cycles
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Fri Jan 17 16:36:04 EST 2003 | MA/NY DDave
Hi As DaveF notes there are many sources. In one of my lives, I used to generate this business for one of the really good outfits i.e NTCu in Bethlehem, PA and I know of several more. You probably already get NTCu's mailing if you have been in the
Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef
MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Electronics Forum | Mon Jun 27 10:45:31 EDT 2005 | franciscoioc
Thank's for the information Bob. I have another question, at the moment my peak reflow is at 218c, this means I am above the 210c a lot of companies run off. If I am building boards using SN63/37 solder paste with lead on my process, and using lead f
Electronics Forum | Tue Jul 19 06:07:30 EDT 2005 | GS
Yes Rob, I would like to know the type of metal finisching like JST097 or IPC-1066 or IEC .... suggest to do. I would like to avoid i.e. to get Bismuth finish on components terminals that I still have to solder with alloy containing Pb. Also to ha
Electronics Forum | Thu Aug 11 07:41:55 EDT 2005 | rsmith@z-mar.com
I do recommend dedicated tips and dedicated workstations. Make sure that your tips come in with no lead in the tinning. There is a new, green heat resistant table mat that is being used in the industry to identify lead free areas. If operators see gr
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
