Electronics Forum | Wed Sep 08 16:44:15 EDT 1999 | Rob Jankowski
I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasing
Electronics Forum | Sun Jun 12 19:22:52 EDT 2005 | techknow..
When examining a Bga using an Ersascope, I found that all the joints where good. However I found that the first few solder balls from left to right ( vice versa ) seem higher than the middle solder balls. It appears that the body of the part is flex
Electronics Forum | Wed Jul 25 13:29:24 EDT 2007 | realchunks
Hi Lloyd, Homeplates will get rid of solder balling. They are only recommended "backwards" for 0402 or smaller (Points point away from each other). If you do this, you will have a full pad width of paste on the pad for the part to stick in. Obvio
Electronics Forum | Tue Apr 04 06:22:07 EDT 2000 | Neil Stoddart
Help. We are moving to a no clean solder paste and have the following concerns regarding solder balls. What standards are currently being followed concerning solder balls on SMT assemblies? Are these standards realistic and can they be easily achie
Electronics Forum | Thu Apr 05 11:48:25 EDT 2012 | pbarton
Are you running individual point soldering on each component lead, of are you drawing lines with the solder fountain to increase the speed of the process? Could be that if you are drawing lines, coupled with the very low flux levels you say you are
Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
