Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Mon Dec 16 17:35:43 EST 2002 | davef
Jim Consider issuing a purchase order to your assembler for the purchase of selective wave soldering pallets required to solder your board. That way, you: * Own the pallets. * Can take the pallets with you should you decide that another assembler
Electronics Forum | Tue Dec 17 13:42:04 EST 2002 | robf
There are a few emerging technologies that have been growing in popularity for the past few years. Pin through paste, press fit connectors and selective soldering machines seem to be displacing custom fixtures. Most of the mixed technology boards o
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef
Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti
Electronics Forum | Mon Nov 17 13:26:05 EST 2008 | evtimov
With the gun you can do removal. Than clean the pads, put some flux, place new BGA(or reballed one) and put it in the reflow oven(if you have one). That's the cheap way you can go without buying an equipment. The other way is to buy machine for BGA
Electronics Forum | Sun Nov 23 10:03:19 EST 2008 | tsvetan
Hi, yes, you can, but it will be subject to long learn curve where i live there are hundreds of GSM repair shops which do BGA rework and replacement with $50 hot air guns only, but i guess they had lot of BGAs damaged before they have learned how to
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Thu Sep 29 19:18:24 EDT 2005 | HLy
Hi, I noticed that the solder joints on my BGAs end up with a lot of wrinkles after reflow. See picture at: http://pstr-r02.ygpweb.aol.com/data/pictures/02/01A/17/DD/E3/9E/n8BhepQLFDs6GMSwaRNxPCTWR5NdpUJZ0300.jpg Does anybody have any ideas what cau
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
