Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Electronics Forum | Fri Jun 25 09:19:12 EDT 2004 | tjensen
60-70% RH will be a challenge if you are running a water wash solder paste (and could be the reason you are seeing the problems). If you are running a no-clean, humidity should not be an issue. As long as the profile looks OK, I don't think the con
Electronics Forum | Wed Aug 11 07:41:52 EDT 2004 | gregoryyork
Check cure of solder resist. Use a No clean low solids rosin flux this will stop problem. Should see almost zero solder balls if put through a single wave compared to a dual wave. If this is true then it is a resist issue and cannot 'resist' the sold
Electronics Forum | Sun Jun 12 08:37:20 EDT 2005 | davef
Paramjeet Singh Gill Flip chip with aqueous flux, that's interesting. * What is the stand-off from the board is your flip chip? * What machinery and materials do you use clean your boards? * How do determine the cleanliness of the board under the fl
Electronics Forum | Tue Jan 16 14:53:24 EST 2001 | davef
Yanno what's interesting on that topic? A small number of voids make the solder connection of a BGA stronger than no voids. Moral of the story ... don't get too anal about voids. You should check the archives ;-) [har har har] we've discussed this
Electronics Forum | Tue Dec 29 04:27:08 EST 1998 | John W
| I have an inbteresting problem on my N2 wave soldering lines. | We have two N2 wave soldering line. Line A is old one and Line B is new. | We found solder balling Phenomenon on PCB After soldering in the new N2 Atmosphere Wave Soldering Machine. In
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Fri Jan 28 10:09:50 EST 2000 | mike d
Istvan, One possible reason for this is that you are using a water soluble flux in your wave solder machine. If you are and the boards are not pre heated long enough, the water in the flux does not evaporate before hitting the wave. When the water
