Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW
| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t
Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Wed Oct 04 16:54:24 EDT 2006 | cw
OK. Thanks!! Lastly, is it the nature of the chemistry that Sn/Pb solder mixed with Pb-free alloy will be getting voids? If so, what's the physic/chemistry behind it?
Electronics Forum | Fri Oct 13 06:44:18 EDT 2006 | Matt Kehoe
Solid Solder Deposit may work www.sipad.com mk
Electronics Forum | Thu Jun 28 09:43:25 EDT 2012 | ssupertuba
I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
Electronics Forum | Wed Oct 04 16:19:54 EDT 2006 | russ
you may want to try a different MFGR of paste, this does help on many occasions. Russ
