solder and ball

"solder and ball" search results in the Electronics Forums

2092 results found for "solder and ball" in the Electronics Forums

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LGA Rework

Mar 27, 2015 | We reflow solder balls to the LGA using a tacky paste flux. Then we install the LGA to the PCB usin

paste quality

Feb 10, 2014 |

SMT voiding

Oct 25, 2012 |


Jan 7, 2011 | Consider measuring the temperature of the BGA solder balls during reflow. This will give you a more

PCB Surface Question - Picture attached

Mar 25, 2010 | I would not use the product. Solder balls on a massive scale would be one issue due to all the expos

Disposal of ultrasonic cleaning water

Jun 24, 2008 | Your flux residues may be acceptable for your drain, but the solder balls won't be. You'll need to f

Vapor (vapour) Phase?

Jun 18, 2008 |

Cleanning no clean residu

Oct 26, 2007 |

Homeplate design

Jul 25, 2007 | Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste)

To use a mini stencil, or not to use a mini stencil.

Mar 29, 2007 | We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using

BGA via in pad

Mar 23, 2007 | Hello, those plated and solderable via in pads have two critical points: 1. We have discovered t

Ag/Pd Component Finish

Jun 29, 2006 | Hi Slaine, The terminations are still present on the component but all the solder (including the

BGA Rework

Apr 14, 2006 | Have done some rework on BGAs but what kind of minimal pitches/solder balls you dealing with and wha

Gold Flash with QFN28 problem

Mar 30, 2006 | So you have solder balls at the outer edge of the part right where the pad goes underneath? If so y

Stencil thickness

Mar 2, 2006 |

TAL during reflow

Feb 8, 2006 | 'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5

Heat guns and component damage

Feb 1, 2006 | Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found


Oct 28, 2005 | I have always encountered problems when using Kester (everything from bad solder to solder balls). I

Measuring intermetallic compound

Aug 24, 2005 | Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming acros

Mosfet stencil design

Jul 18, 2005 | I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming undern

Lead Free Stencil Design

Jul 13, 2005 |

Lead Free Stencil Design

Jul 13, 2005 | We do have solder balling on occasion but it is usually very minimal. When and if this becomes an i

Maximum Overprint

Jun 28, 2005 | Anyone know of a maximum solder overprint formula? I need to overprint a 0.011" wide aperture but w

Type of NEXLEV Connector

Apr 23, 2005 |

Non-wetting: PTH on double-side reflow

Apr 6, 2005 | It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did


Apr 3, 2005 | In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and col

Reflowing <.032

Feb 18, 2005 |

BGA Via Tenting

Jan 21, 2005 |


Jan 19, 2005 |

Cap Short

Nov 22, 2004 |

Suggested Process changes

Nov 11, 2004 |

BGA Rework

Apr 28, 2004 | Are your solder balls after reflow a perfect sphere or are they oblong, like chushed. I know a heav

Indium NC-SMQ92J paste problems

Apr 27, 2004 | We have switched over form Indium's nc-smq92 to > nc-smq92j and are experiencing a ton of solder

No Lead BGA Hot Gas Rework

Apr 12, 2004 | I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason w

 Reflow System

fluid dispensing pumps for integration