solder and ball

"solder and ball" search results in the Electronics Forums

2092 results found for "solder and ball" in the Electronics Forums

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LGA Rework

Mar 27, 2015 | We reflow solder balls to the LGA using a tacky paste flux. Then we install the LGA to the PCB usin

Using RoHS Components in a leaded paste world

Oct 31, 2013 | You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most l

Cleaning paste-printed PCB

Sep 4, 2012 | The best thing you can do is to clean the board that has a solder paste defect on it. If you don't y

BGA re-reflow

Dec 24, 2011 |

BGA Thermal Profiling

Aug 19, 2011 |

BGA Reflow

Jun 13, 2011 | Had you check the temperature difference of outer balls and inner balls? Solder short in corners mig

PCB Surface Question - Picture attached

Mar 25, 2010 | I would not use the product. Solder balls on a massive scale would be one issue due to all the expos

BGA opens

Nov 10, 2009 |

defects in pcb manufacturing

Nov 2, 2009 | Base on the top picture condition, seems like the boards condition is a lot with solder splash or so

Disposal of ultrasonic cleaning water

Jun 24, 2008 | Your flux residues may be acceptable for your drain, but the solder balls won't be. You'll need to f

Epoxy on bottom of SMT component

Nov 29, 2007 | Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball i

BGA dropping off underside of board

Aug 13, 2007 | Would I be correct in assuming that the solder used to attach the BGA ball to the device body should

Homeplate design

Jul 25, 2007 | Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste)

To use a mini stencil, or not to use a mini stencil.

Mar 29, 2007 | We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using

Streaking at Screen Printing

Dec 17, 2006 | Paul We've seen "cold welding" of solder paste when dispensed improperly. It occurs in the narro

Copper migration

Dec 7, 2006 | Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder pa

Pasting ahead

Nov 13, 2006 |

Ag/Pd Component Finish

Jun 29, 2006 | Hi Slaine, The terminations are still present on the component but all the solder (including the

BGA Rework

Apr 14, 2006 | Have done some rework on BGAs but what kind of minimal pitches/solder balls you dealing with and wha

Stencil thickness

Mar 2, 2006 |

TAL during reflow

Feb 8, 2006 | 'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5

BGA rework using Tacky Flux

Jan 16, 2006 | Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding o

Measuring intermetallic compound

Aug 24, 2005 | Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming acros

Mosfet stencil design

Jul 18, 2005 | I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming undern

Lead Free Stencil Design

Jul 13, 2005 |

Lead Free Stencil Design

Jul 13, 2005 | We do have solder balling on occasion but it is usually very minimal. When and if this becomes an i

Type of NEXLEV Connector

Apr 23, 2005 |

Non-wetting: PTH on double-side reflow

Apr 6, 2005 | It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did


Apr 3, 2005 | In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and col

Reflowing <.032

Feb 18, 2005 |


Jan 19, 2005 |

Cap Short

Nov 22, 2004 |

Crystalized Flux under BGA

Aug 3, 2004 | Hi, What contributes to the above? I've got some BGA solder joints with a crystal like flux attac

Via in pad

Jun 11, 2004 |

BGA Rework

Apr 28, 2004 | Are your solder balls after reflow a perfect sphere or are they oblong, like chushed. I know a heav

Indium NC-SMQ92J paste problems

Apr 23, 2004 | Sometimes solder balling is related to oxidized paste or paste that has sat on the pcb too long befo

No Lead BGA Hot Gas Rework

Apr 12, 2004 | I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason w

Flux-Free Reflow Soldering

Reflow Oven