solder and ball

"solder and ball" search results in the Electronics Forums



2092 results found for "solder and ball" in the Electronics Forums

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Reflow with lead-free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts

Dec 26, 2019 | Doesn't really look like no-clean to me...typically, no-clean encapsulates the solder joint after re

BGA REWORK ISSUE

Jul 8, 2013 | The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via.

BGA non wetting

Sep 14, 2010 | Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on t

BGA Placement Process

Apr 5, 2010 |

Vapor (vapour) Phase?

Jun 18, 2008 |

BGA dropping off underside of board

Aug 13, 2007 | The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent

Reflow Profile Design

Jun 15, 2007 |

BGA opens / cracks

Jan 24, 2007 |

Tin Lead BGAs in leadfree paste ( pb-free paste )

Mar 12, 2006 | Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had n

BGA Rework Equipment

Mar 3, 2006 |

Fine Pitch Stencil Design

Dec 14, 2005 |

QFN Packages

Feb 25, 2005 |

Reball BGA process flow

Feb 9, 2005 | Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electri

dendritic growth

Dec 14, 2004 |

BGA Pull test

Oct 25, 2004 |

No Lead BGA Hot Gas Rework

Apr 13, 2004 | I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviou

Large Voids with Via in Pad

Apr 13, 2004 | Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduo

Voiding in board to BGA joints

Mar 9, 2004 | Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BG

BGA vrs CGA....

Sep 23, 2003 | Look out for shorts due to too big pads / balls colasping too much / too much solder paste though. t

Screen Printing for BGA

Aug 21, 2003 | Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that coul

Snapshot Process

Jan 31, 2003 |

Via in Pad

Sep 13, 2002 |

BGA Contact

Jul 25, 2002 |

AOI vs AXI

Jun 6, 2002 |

BGA's shorting

Oct 3, 2001 | We are getting solder blobs forming in open areas of the BGA, between the center array and outer arr

Spacing and Yield

Sep 18, 2001 |

Dye Penetration test for area array package failure analysis

Sep 12, 2001 | First, what on the area array package are you analyzing � * Package cracking? * Cracked solder ba

Number of thermal excursions per componet

Jun 27, 2001 | BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from b

Process Qualification

Jun 18, 2001 |

What Will I See

Jun 18, 2001 |

Flexible high speed pick & Place

Non-heated dispensing system