solder and ball

"solder and ball" search results in the Electronics Forums

2092 results found for "solder and ball" in the Electronics Forums

Order by: Relevancy |   Date

BGA drop off from the boards

May 23, 2014 | Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls sha


Jul 3, 2013 |

Air Moisture in Production

Dec 8, 2010 | 3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Idea

BGA non wetting

Sep 14, 2010 | Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on t

BGA Placement Process

Apr 5, 2010 |

Land Grid Array (LGA) Rework

Aug 25, 2008 | Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sen

Reflow Profile Design

Jun 15, 2007 |

Lead Free BGA's on non-RoHS Assembly

Jan 29, 2007 | What does your customer want you to do? I would not want a CM soldering one of my boards with leadf

BGA opens / cracks

Jan 24, 2007 |

BGA Rework

Aug 25, 2006 |


Jul 12, 2006 |

Mix Pb and Pb free alloy

May 24, 2006 |

Palladium poor wetting

May 23, 2006 |

Tin Lead BGAs in leadfree paste ( pb-free paste )

Mar 12, 2006 | Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had n

BGA Rework Equipment

Mar 3, 2006 |


Feb 1, 2006 | Your method of only using solder paste to form the solder joint w/out collapsing the ball is very un

Fine Pitch Stencil Design

Dec 14, 2005 |

Reball BGA process flow

Feb 9, 2005 | Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electri

dendritic growth

Dec 14, 2004 |

BGA Pull test

Oct 26, 2004 |

Can I use lead free BGA parts in a lead based process?

Jun 13, 2004 | Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our


May 12, 2004 | You say you have lots of problems with a BGA, tell us about: * Specific problems you see. * Solder

No Lead BGA Hot Gas Rework

Apr 13, 2004 | I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviou

Large Voids with Via in Pad

Apr 13, 2004 | Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduo

Voiding in board to BGA joints

Mar 9, 2004 | Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BG

BGA Picture Evaluation

Apr 11, 2003 | I'd say your profile is about right, assuming these are values that you measured in the balls of thi

BGA Rework

Apr 10, 2003 |

Snapshot Process

Jan 31, 2003 |

Making a BGA stand up

Jan 13, 2003 | Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the

Board with immersion Tin

Nov 25, 2002 |

baking boards, revisited

Oct 4, 2002 |

Conformal Coating Machine under 40000

Flux-Free Reflow Soldering