solder and ball

"solder and ball" search results in the Electronics Forums



2092 results found for "solder and ball" in the Electronics Forums

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Temperature Profile for 0.2mm Thick ENIG Flex PCB

Jan 31, 2020 | Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2

Flason SMT Products

Oct 3, 2018 |

BGA pad size too large??

Sep 7, 2011 |

BGA REFLOW

Feb 1, 2011 |

BGA Voids

May 19, 2010 | Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like

SAC BGA in Pb Process

Mar 29, 2010 | SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale p

Agilent 5DX

Apr 7, 2009 |

Agilent 5DX

Jan 29, 2009 |

BGA thermal reflowing issue

Sep 26, 2008 | Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what ha

SAC305 Lead Frame Component with Leaded Process?

Sep 16, 2008 | Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the s

Lead Free De-Wetting...

Apr 25, 2008 |

0.5mm CSP Reliability

Apr 24, 2008 | Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicat

BGA dropping off the board

Feb 14, 2008 | That is bizarre. I would have to say that you need to do a test on the PCB to test solderability wit

Homeplate design

Jul 25, 2007 |

Lead free rework of BGA

Jan 17, 2007 |

Cracking

Sep 7, 2006 | Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has c

Functional Test Faulure due to BGA ICs

Jul 25, 2006 | If your Test tech able to analyze and tell you which exact ball/location is the problem, you may sen

gold wire bonding

Dec 28, 2005 | I have lots of experience with thermosonic gold ball bonding. You can read the literature and you w

How to prevent Bluetooth Module BGA short anybody?

Nov 23, 2005 | Shorted to the sheild or the BGA balls are shorted? Sheilds move a lot during reflow. If this is t

SMT Product Line Expansion

Apr 28, 2005 | If what you are talking about is "assembly materials", then consider the following: - Solder past

Open BGA joint

Sep 15, 2004 | if opens in same aria check for mask to via coverage for that pad. We had vias pulling solder from p

BGA open joint

Aug 4, 2004 | Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the th

BGA Inspection Equipment

Jul 19, 2004 |

Help for replacing BGA with metal heat sink

Sep 25, 2003 | To be precise, the component is a Xilinx Virtex platform FPGA with 1152 balls. We also assemble som

Screen Printing for BGA

Aug 20, 2003 |

Leadfree component plating on Sn/Pb paste

Jul 2, 2003 | Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PAS

BGA Picture Evaluation

Apr 10, 2003 | Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder jo

BGA attach eval.

Apr 3, 2003 |

BGA attach eval.

Apr 3, 2003 |

BGA attach eval.

Apr 1, 2003 | Well, here is what I have found so far. I have removed the top of the BGA and found that the ball h

0402 stencil design

Feb 4, 2003 | You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight

BGA PCB Pad size

Jan 19, 2003 | You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue

Standard for BGA void

Oct 21, 2002 | I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, the

mirco bga stencil opening

Sep 12, 2002 |

pcb assembly equipment - robotek

Software for SMT