solder and ball

"solder and ball" search results in the Electronics Forums

2092 results found for "solder and ball" in the Electronics Forums

Order by: Relevancy |   Date

Other Jet Printer besides MYCRONIC?

Jan 11, 2019 | Jetting paste is no easy , ball mesh size and metal loading, SG and the dynamic rehology of the flux

BGA pad design

Dec 4, 2015 | In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Prin

BGA vs LGA. Which to choose?

Oct 5, 2015 | We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions

Voids with LGAs

Jan 18, 2013 | Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste

BGA Reflow

Jun 8, 2011 | Two thoughts from me: 1)Are you sure the balls are collapsed? Have you looked at the perimeter fro

Soder Paste Shelf life extension

Feb 19, 2011 | Just a thought. What is the real shelf life of the past? Do manufactures low ball the self life to s

Dip Fluxing Cavity Depth

Jan 26, 2011 | From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball di

BGA Placement Process

Mar 26, 2010 |


Feb 10, 2010 |

Wirebond issues near SM

Oct 8, 2009 |

Importance of Exposed Pad In ST QFP for Set top box product

Oct 1, 2009 | First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond t

BGA Pad Cratering

Jun 5, 2009 | This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causi

Land Grid Array (LGA) Rework

Sep 2, 2008 | Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA re

BGA process

Jul 16, 2008 |

BGA process

Jul 11, 2008 | BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a mu

Land size

Jul 7, 2008 | Most QFP 128s have a 0.16mm wide lead. Might have to modify your pads if you'r buying some odd ball

Reflow Profile Design

Jun 15, 2007 |

BGA opens

May 2, 2007 | to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls)

BGA Rework

Feb 23, 2007 |

BGA Tilt

Feb 12, 2007 | the center part of the BGA balls may not fully reflow or melt and cause BGA tilt, not functioning wo

BGA Tilt

Feb 9, 2007 |

BGA opens

Jan 23, 2007 |


Dec 5, 2006 |

Copper migration

Dec 4, 2006 | Hello, I did EDX on BGA just to find out copper wt% at the package- ball interface. Is wt% rang

up2000 HiE hates me

Oct 31, 2006 |


Oct 3, 2006 |

BGA Rework Equipment

Aug 16, 2006 |

BGA Rework Equipment

Aug 16, 2006 |

Recycling components

Aug 3, 2006 |

Recycling components

Aug 3, 2006 |

Mix Pb and Pb free alloy

May 24, 2006 | So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliabi


Dec 16, 2005 | There are some RoHS BGA:s that are within the "so called" solder joint strength & reliability, that

Propensity of Immersion Tin surface finish fo whiskers

Dec 12, 2005 | thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there w

BGA Reballing

Dec 8, 2005 |

PCB separators

pcb components vacuum pick up