Electronics Forum | Fri Aug 24 12:39:59 EDT 2007 | hussman
I would say no, unless your machine is in extremeconditions. You may want to check your flux / preheat out as well. If you are leaving a lot of flux on the board at wave, it may be boiling - which can cause solder balls.
Electronics Forum | Mon Jul 16 09:04:00 EDT 2001 | Hussman
No argument here. But I've don't think I've ever seen solder balls on 0402s. Even when they're placed on narrow G dimension pads, where there is little toe fillet, I've never seen a solder ball. But your idea of reversed homeplates would work grea
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Nov 17 03:34:51 EST 2005 | cangly
Hi, We have a board with over 100 chips (mixed size) and some long Connector DIP through out Wave solder with many issues of no solder and solder bridge, (using clean flux with bubble fluxer and Kester solder bar). Currently we tried to reduce the de
Electronics Forum | Thu Nov 17 13:13:49 EST 2005 | Mike
Hello, Some questions.... Are you running lead free? What alloy? What�s your pot temp at? Temp of the board after preheat? Are you getting any solder in the barrels (
Electronics Forum | Mon Nov 21 06:49:57 EST 2005 | pjc
Go to this link for a nice tool for wave solder process troubleshooting: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnId=5 Look for "Wave Solder Troubleshooting Wizard" If you have an Electrovert machine, contact applica
Electronics Forum | Thu Nov 17 20:23:14 EST 2005 | cangly
Hi Russ, We control the gravity of flux each 8 hours and will mix thinner to balance it if any.. Do we need more any action for this.. Thanks for your advices.
Electronics Forum | Fri Nov 18 08:31:09 EST 2005 | jdengler
This is way too long of a time. The SG probably changes significantly over this time. This could be a major contributor to your problems. Jerry
Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ
No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
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