Electronics Forum | Mon Aug 14 13:48:03 EDT 2023 | spoiltforchoice
Well gasketing yes, have you dine enough analysis to blame aperture design- Maybe not? Maybe whip out the gerber files for this PCB&stencil and compare the details with one you feel works well. Is there something different about their layout rules o
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Electronics Forum | Mon Oct 11 12:24:07 EDT 1999 | John Thorup
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%
Electronics Forum | Wed May 25 18:30:11 EDT 2022 | stephendo
And laser diode reflow soldering as well!
Electronics Forum | Thu Apr 05 03:19:04 EDT 2018 | myke03o
We are currently in a Clean solder process (SMT+Wave Solder+Washing). Now our management is planning to convert to a No-Clean process in SMT due to limitations of solder availability and reduction of washing process. Question1: Is it possible to was
Electronics Forum | Wed May 25 16:48:54 EDT 2022 | emeto
Why not having the P&P in there too?