Electronics Forum | Thu Aug 24 17:08:58 EDT 2000 | Dr. Ning-Cheng Lee
Depending on the stress condition experienced by the solder joints. For joints under a greater stress, the time to reach equilibrium can be shorter. Of course, the change is also more significant in phase structure. For low stress conditions, it may
Electronics Forum | Mon Apr 19 02:49:56 EDT 1999 | Raul N.
25 PPM)! 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate for the ga
Electronics Forum | Mon Nov 15 21:32:31 EST 1999 | Dave F
Wolfgang: Sounds like gluteus maximus protection time. 1 "Maximum suitable temperature for the solder joint should be half the liquidous temperature" is a good rule of thumb. Where it came from, I don�t know. One place I�ve seen it repeated is: H
Electronics Forum | Mon Jun 09 14:09:06 EDT 2014 | jorge_quijano
Hola... I'm in the middle of a project to reduce assembly time in one of our products, this product has a lot of TH connectors to be soldered by hand, I'm implementing PHIR, first run has been completed, the appearance of the solder joints are obvio
Electronics Forum | Fri Dec 22 09:39:22 EST 2000 | CAL
Some random Ideas when I read you post...... 1) If it works don't fix it. 2) Be aware of the temp threshold of your components....Over heating components is not good. Over heating is not good period. 3) The Solder paste Chemistry you are using maybe
Electronics Forum | Tue Jan 18 20:31:10 EST 2000 | WDavidson
It makes a difference what the normalizer is. We calculate solder ppm and placement ppm separately for each assembly. Solder ppm = #solder defects*1E6/(Qty boards*#solder joints per board). For us this number is easily less than 50 and sometimes
Electronics Forum | Mon Nov 30 20:17:27 EST 1998 | Dave F
All y'll: I could use your input on determining when to skim dross from a wave solder pot. On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder joint quality. On another hand, ov
Electronics Forum | Wed Nov 06 19:03:33 EST 2002 | broncos
If you are certain that reflow process is good, I would suggest starting checking the following: 1. Check to see if leads / pads are contaminated or oxidized. However, this usually results poor solder quality throughout the board. 2. Check the amou
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
